JPS6087675A - 整流装置 - Google Patents
整流装置Info
- Publication number
- JPS6087675A JPS6087675A JP58196468A JP19646883A JPS6087675A JP S6087675 A JPS6087675 A JP S6087675A JP 58196468 A JP58196468 A JP 58196468A JP 19646883 A JP19646883 A JP 19646883A JP S6087675 A JPS6087675 A JP S6087675A
- Authority
- JP
- Japan
- Prior art keywords
- rectifier
- semiconductor
- fin
- soldering
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 238000001816 cooling Methods 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 239000007787 solid Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 239000010949 copper Substances 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 5
- 229920002379 silicone rubber Polymers 0.000 abstract description 3
- 239000004945 silicone rubber Substances 0.000 abstract description 3
- 239000007790 solid phase Substances 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000007664 blowing Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/02—Conversion of AC power input into DC power output without possibility of reversal
- H02M7/04—Conversion of AC power input into DC power output without possibility of reversal by static converters
- H02M7/06—Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes without control electrode or semiconductor devices without control electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58196468A JPS6087675A (ja) | 1983-10-19 | 1983-10-19 | 整流装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58196468A JPS6087675A (ja) | 1983-10-19 | 1983-10-19 | 整流装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6087675A true JPS6087675A (ja) | 1985-05-17 |
JPH0440945B2 JPH0440945B2 (en]) | 1992-07-06 |
Family
ID=16358300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58196468A Granted JPS6087675A (ja) | 1983-10-19 | 1983-10-19 | 整流装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6087675A (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5828564A (en) * | 1997-02-25 | 1998-10-27 | Mitsubishi Denki Kabushiki Kaisha | Rectifier heat dissipation |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51272A (ja) * | 1974-06-19 | 1976-01-05 | Hitachi Ltd | Denkikairosochioyobisono seiho |
-
1983
- 1983-10-19 JP JP58196468A patent/JPS6087675A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51272A (ja) * | 1974-06-19 | 1976-01-05 | Hitachi Ltd | Denkikairosochioyobisono seiho |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5828564A (en) * | 1997-02-25 | 1998-10-27 | Mitsubishi Denki Kabushiki Kaisha | Rectifier heat dissipation |
Also Published As
Publication number | Publication date |
---|---|
JPH0440945B2 (en]) | 1992-07-06 |
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